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BPM Support for eMMC Devices in HS400 Mode

BPM Support for eMMC Devices in HS400 Mode

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

Manufacturer/Device Package 9th Gen Socket Purchase Online
Hynix Semiconductor H26M41208HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Hynix Semiconductor H26M41204HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Kingston EMMC04G-W627-X03U (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Micron MTFC4GACAJCN-1M WT (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
SanDisk SDINBDG4-16G (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLMAG1JETD-B041 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLM4G1FETE-B041 (HS400) BGA(153) Yes FVE4ASMC153BGR Yes
SkyHigh S40FC004C1B1C0000 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes

*HIC Socket (high capacity)


New eMMC Support for HS400 Mode

Hynix Semiconductor H26M41208HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Hynix Semiconductor H26M41204HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8804892672
  • Memory Regions: 0h-1 EFA7 FFFFh; 1 EFA8 0000h-2 0CCF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Kingston EMMC04G-W627-X03U (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4270325760
  • Memory Regions: 0h-F063 FFFFh; F064 0000h-FE87 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

Micron MTFC4GACAJCN-1M WT (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4402446336
  • Memory Regions: 0h-F7D3 FFFFh; F7D4 0000h-1 0667 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

SanDisk SDINBDG4-16G (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17737187328
  • Memory Regions: 0h-3 E67B FFFFh; 3 E67C 0000h-4 2137 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLMAG1JETD-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17597988864
  • Memory Regions: 0h-3 DEA5 FFFFh; 3 DEA6 0000h-4 18EB FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLM4G1FETE-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGR

SkyHigh Memory S40FC004C1B1C0000 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ
HS400 Programming Improves eMMC Performance

HS400 Programming Improves eMMC Performance

According to the JESD84-B51 standard, eMMC v5.1 supports the following bus speed modes and clock frequencies:

Mode

Data
Rate

I/O Voltage

Bus Width
(bits)

Frequency

Max. Data Transfer 

HS400 Dual

1.8/1.2 V

8

0-200 MHz

400 MB/second

HS200

Single

1.8/1.2 V

4, 8

0-200 MHz

200 MB/second

High-Speed DDR

Dual

3/1.8/1.2 V

4, 8

0-52 MHz

104 MB/second

High-Speed SDR

Single

3/1.8/1.2 V

1, 4, 8

0-52 MHz

52 MB/second

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

BPM has recently added support for the following eMMC devices in HS400 Programming Mode:

Manufacturer/Device Package 9th Gen Socket Purchase Online
SanDisk SDINBDG4-8G (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Samsung KLMCG2KCTA-B041000 (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Micron MTFC32GAKAEJP-AIT (HS400) BGA(153) Yes FVE4ASMC153BGZ
Micron MTFC32GAKAECN-4M IT (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRQ (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRN (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRI (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRA (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes

HS400 Programming Mode

SanDisk SDINBDG4-8G (6/22/2021)

SanDisk SDINBDG4-8GDevice Parameters

  • Manufacturer: SanDisk (ID=45h)
  • Part Number: SDINBDG4-8G (HS400) (ID=3038h)
  • 8-bit Bytes: 8807030784
  • Memory Regions: 0h-1 EFC6 CFFFh; 1 EFC6 D000h-2 0CF0 9FFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Samsung KLMCG2KCTA-B041000 (6/22/2021)

Device Parameters

  • Manufacturer: Samsung (ID=15h)
  • Part Number: KLMCG2KCTA-B041000 (HS400) (ID=3432h)
  • 8-bit Bytes: 70354206784
  • Memory Regions: 0h-F 7877 FFFFh; F 7878 0000h-10 616F FE1Fh; 10 616F FE20h-10 6170 003Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 64 GByte
  • Socket: FVE4ASMC153BGJ

Micron MTFC32GAKAEJP-AIT (6/22/2021)

Micron-MTFC32GAKAEDevice Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAEJP-AIT (HS400) (ID=374Ch)
  • 8-bit Bytes: 35181822048
  • Memory Regions: 0h-7 BC7F FFFFh; 7 BC80 0000h-8 30FF FE3Fh; 8 30FF FE40h-8 3100 005Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGZ

Micron MTFC32GAKAECN-4M IT (6/22/2021)

Micron-MTFC32GAKAE

Device Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAECN-4M IT (HS400) (ID=374Ch)
  • 8-bit Bytes: 33218887808
  • Memory Regions: 0h-7 4DFF FFFFh; 7 4E00 0000h-7 BBFF FE5Fh; 7 BBFF FE60h-7 BC00 007Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRQ (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRQ (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 Gig
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRN (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRN (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRI (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRI (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRA (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRA (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ
BPM Releases Support For Renesas Automotive Microcontroller

BPM Releases Support For Renesas Automotive Microcontroller

BPM Releases Support For Renesas Automotive Microcontroller

Renesas R7F7015433AFP-C for Automotive Electrical Body Applications

The RH850/F1K is one group of single-chip microcontrollers in the RH850/F1x series which is designed for automotive electrical body applications. While it achieves low power consumption, the internal flash memory ranges from 768KB to 2MB and the package covers a wide range from 100 to 176 pins. Also, a CAN FD interface has been added (premium products only) and the CPU operating frequency has been improved to 120MHz. See more here.

  • Renesas R7F7015433AFP-CPackages: QFP(144)
  • Category: MCUs and MPUs – RH850 Family (Automotive only) – RH850/F1K
  • Device Type: 32-bit G3M CPU core
  • Device Size: 2MBytes Code Flash + 32KBytes User Area + 64KBytes Data Flash
  • Algorithm Programming Method: 3-Wire Serial I/O Mode
  • 9th/8th Gen Socket Solution: FVE2ASM144LQFPA
  • Available on BPM’s Process software BPWin Versions released after 01/14/2021
  • Note: Replaceable burn-in test socket

Unique Support

As of publication, BPM has the only supported solution for this particular device. Renesas devices currently supported by BPM stand at 1,762.

  Supported* Socket
Elnec No  
Data I/O No  
Dediprog No  
BPM Yes FVE2ASM144LQFPA

*As of publication

9th Gen

9th Generation Site Technology delivers the fastest programming times, 2 to 9 times faster for flash devices. Vector Engine Co-processing with BitBlast offers the fastest programming speeds in the industry, vastly increasing throughput.

FVE2ASM144LQFPABPM Advantages

The socket card (FVE2ASM144LQFPA) is built with a replaceable burn-in test socket. This means when the socket wears out, simply remove it and replace it with LSOCQ144EA-2, rather than replacing the whole socket card (adapter). This socket allows for up to 2 devices to be programmed in parallel and will work with both manual and automated systems on 9th and 8th Gen systems.

BPWin Software Support

In order to fully take advantage of new device support from BPM Microsystems, you’ll need a version of BPWin after 1/14/2021. All engineering manual programmers (they start with a “1” such as the 1710) come with lifetime software support. New programmers come with one year of software support; if your software contract has lapsed, please contact Inside Sales to take advantage of daily additions and improvements in device support.

Number of Devices Supported by 9th Gen

BPM releases support for Atmel High-Performance PLD

BPM releases support for Atmel High-Performance PLD

Atmel Support for SOIC (Small Outline Integrated Circuit) ATF16V8B-15SU-T

The ATF16V8B-15SU-T provides edge-sensing low-power PLD (Programmable Logic Device) solution with low standby power consumption (5mA typical). It powers down automatically to the low-power mode through the Input Transition Detection (ITD) circuitry when the device is idle. See more here.

  • Fuses: 2194
  • Gates: 250
  • Package: SOIC(20)
  • Temp Range: -40C to +85C
  • Electrical Erase: Yes
  • Secure: Yes
  • 9th Gen Socket Solution: FVE4ASMR20SB
  • Available on BPM’s Process software BPWin Versions released after 01/14/2021

The PLD programming support from BPM has been qualified by the Atmel PLD Applications group. Read more here.

Unique Support

As of publication, BPM has the only supported solution for this particular device. Atmel devices are particularly “challenging” to support, and no one has as many Atmel devices supported as BPM (currently 4781).

  Supported* Socket
Data I/O no  
Dediprog no  
BPM Yes FVE4ASMR20SB

*As of publication

9th Gen

9th Generation Site Technology delivers the fastest programming times, two to nine times faster for flash devices. Vector Engine Co-processing with BitBlast now supports HS400. BitBlast offers the fastest programming speeds in the industry, vastly increasing throughput.

BPM Advantages

The socket card (FVE4ASMR20SB) is built with a replaceable socket. This means when the socket wears out, simply remove it and replace it with LSOCS20EA, rather than replacing the whole socket card (adapter). This socket card allows for up to 4 devices to be programmed in parallel per site and will work with both manual and automated systems.

BPWin Software Support

In order to fully take advantage of new device support from BPM Microsystems, you’ll need a version of BPWin after 1/14/2021. All engineering manual programmers (they start with a “1” such as the 1710) come with lifetime software support. New programmers come with one year of software support; if your software contract has lapsed, please contact Inside Sales to take advantage of daily additions and improvements in device support.

Device Search Socket Decoder Types of Programmables

 

Number of Devices Supported by 9th Gen

Complete Ecosystem

BPM Microsystems has ownership of all designs, manufacturing, and support for all programming sites, robotics, vision systems, and software, so we can provide unmatched support and responsiveness

  • Reduce your time to market by doing New Product Introduction/First Article through Automated Production with the same hardware, algorithms, and software

9th Generation Site Technology

Manual Programmers for this Device

Available for purchase in North America (US/Canada/Mexico)

BPM Support for eMMC Devices in HS400 Mode

New HS400 Device Support for SanDisk, SK-Hynix

SANDISK SDINBDG48GXIBPM Microsystems is pleased to announce new device support for SanDisk and Hynix eMMC devices with significantly faster HS400 protocol

SanDisk SDINBDG4-8G is an 8GB iNAND Flash Storage device primarily for connected and autonomous cars. Western Digital, the maker of SanDisk, describes this family of flash devices: “Leveraging enhanced flash storage technology for superior reliability, the new iNAND storage devices are designed to support data demands of the latest Advanced Driver Assistance Systems (ADAS). These include cutting-edge infotainment, navigation, HD mapping, V2V/V2I communication, drive event recorders, and autonomous driving. The iNAND EFDs (Embedded Flash Drives) delivers dependable performance even in the most extreme environmental conditions, including ambient temperatures ranging from -40°C to 105°C. Western Digital’s robust iNAND embedded flash drives are ideal for a wide range of connected automotive systems and environments. All of our automotive solutions are AEC-Q100 qualified and are designed to meet the reliability requirements of the automotive industry.”

Typical applications and workloads for the SDINBDG4 are Advanced Driver Assist Systems (ADAS), Navigation / Infotainment, HD Mapping, V2V/V2I Communication, Digital Cluster, Drive Event Recorders, Autonomous Drive, and more.

  • Package: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Maximum Interface Speed: 400MB/second
  • 9th Gen Socket Solutions: FVE4ASMC153BGJ, FVE4ASMC153BGZ*
  • Available on BPWin Versions released after 02/03/2021

Hynix

Hynix Semiconductor H26M41208HPRQHynix Semiconductor H26M41208HPRQ is an 8GB eMMC device in a standard FBGA153 package.  The “Q” version is specifically designed for Automotive applications requiring greater temperature ranges. Hynix describes their eMMC 5.1 device family as a “wide-ranging lineup with longevity of support.” It delivers optimized performance with a maximum interface speed of 400MB per second.

  • Packages: BGA(153)
  • Device Type: eMMC 5.1
  • Algorithm Programming Mode: HS400
  • Maximum Interface Speed: 400MB/second
  • 9th Gen: FVE4ASMC153BGJ, FVE4ASMC153BGZ*
  • Available on BPWin Versions released after 03/11/2021

HS400

While BPM has supported both of these devices in the past, HS400 enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput. From our research, we found other device programming companies also (mostly) support these devices, but they don’t mention HS400, so it’s safe to say they don’t support it.

9th Gen

9th Generation Site Technology delivers the fastest programming times, 2 to 9 times faster for flash devices. Vector Engine Co-processing with BitBlast now supports HS400. BitBlast offers the fastest programming speeds in the industry, vastly increasing throughput for high-density managed NAND devices that utilize the eMMC interface.

BPM Advantages

The two socket cards specified (FVE4ASMC153BGJ [available to purchase on the web**] & FVE4ASMC153BGZ) both have compression-mounted sockets. This means when the socket wears out, simply remove it and replace it with LSOCB169KA-3-MOD, rather than replacing the whole socket card (adapter). Both BPM sockets allow for up to 4 devices to be programmed in parallel and will work with both manual and automated systems. In contrast, Elnec’s socket solution is only one-up per programmer, it doesn’t utilize HS400, and they don’t have an automated solution.

BPWin Software Support

In order to fully take advantage of new device support from BPM Microsystems, you’ll need the latest version of BPWin, BPM’s process software. All engineering manual programmers (they start with a “1” such as the 1710) come with lifetime software support. New programmers come with one year of software support; if your software contract has lapsed, please contact Inside Sales to take advantage of daily additions and improvements in device support.

Device Search Socket Decoder Types of Programmables


*FVE4ASMC153BGZ uses a newer board design optimized for HS400; allows for even cleaner waveforms, with higher potential yields
**FVE4ASMC153BGJ is available for purchase online in the US, Mexico and Canada

 

Number of Devices Supported by 9th Gen

Complete Ecosystem

BPM Microsystems has ownership of all designs, manufacturing, and support for all programming sites, robotics, vision systems, and software, so we can provide unmatched support and responsiveness

  • Reduce your time to market by doing New Product Introduction/First Article through Automated Production with the same hardware, algorithms, and software

9th Generation Site Technology

Manual Programmers for this Device

Available for purchase in North America (US/Canada/Mexico)

Offline Automated Programming vs Inline SMT Programming

Offline Automated Programming vs Inline SMT Programming

In the case study “What is the Best Way to Get Devices Programmed,” BPM Microsystems explored six main ways to get your data on devices. The answer is “Depends.” The short answer is there is no one way that is always better than another. This case study explores two of those six methods: Inline SMT programming and Off-line programming.

A small segment of electronic manufacturing services (EMS) and Original Equipment Manufacturers (OEMs) can use inline programming solutions effectively and economically, compared to off-line programming. A lack of flexibility, high cost, and the specter of obsolescence should raise questions about the long-term viability of Inline programming.

 

 

 

Inline SMT Programming

Inline SMT programming is a solution to consider for narrow segments of device programming requiring short programming times, with medium to high volume, for just one device type. Back in the day, that’s what programmed some of the most popular cell phones, when on-board memory sizes were Mbits compared to today’s designs with Gbit memory sizes. Benefits of inline programming include just-in-time programming (which has its own problems lately; see article here), simplified inventory management, and lean manufacturing. If that sounds like your process, and that process won’t change in the next five years, inline programming should be considered (or possibly programming at test, but that’s for a future article).

There are inline SMT programming solutions available on the market; some are commercial, and others are sophisticated but expensive home-grown systems designed for specific production environments.

When programming times are in excess of the beat rate (beat rate is the total throughput per time on an SMT line) of the SMT line, inline SMT programming becomes less attractive because the programmer is not providing enough parts to keep up with the line speed. In short, programming becomes the line bottleneck. As data density, device complexity, and the number of devices continue to increase, the need to reduce the cost of programming will be amplified like never before. Inline programming becomes less cost-effective and less time-effective as programming time increases because multiple units may be required to keep pace with the line beat rate.

Inline is Wide

Inline solutions attach at the tape feeder table and are large compared to standard tape feeders, taking up to 6 (or more) feeder positions on the placement machine. Depending on the complexity and mix of devices delivered on the tape reel, there may not be spare “real estate” for an inline programmer. It’s important to verify there’s room before committing to an inline solution.

Multiple inline programmers may be required per machine if the programming time is longer than a single system can keep up with, or if multiple programmed devices are needed. That has a double cost: less available tape space, and the expense of additional inline programmers. The potential requirement to add another placement machine makes device programming inline a very expensive process.

Socket Capacity

Inline SMT programming solutions typically utilize sockets to program devices. These sockets are the electro-mechanical interface that uploads the signal from the computer to program a device. A small robotic mechanism moves the blank device into the socket and then returns the programmed device to the tape, which feeds directly to the SMT pick-and-place machine. Sockets are “consumables” and require cleaning, maintenance, and periodic replacement. If a socket fails during production, the SMT line may idle until it is replaced. BPM Automated systems have built-in fault tolerance; if a socket fails, the system simply bypasses that socket until it can be replaced—reducing downtime and maintaining throughput.

Backups

Inline programmers often require redundant backup units because of the high cost associated with line-down events. Depending on the number of SMT lines and the diversity of equipment brands, each placement machine may require dedicated inline programming hardware that cannot be shared across platforms.

Expensive

Inline SMT programming solutions tend to be costly, especially when backup systems are required. If the SMT line is idle, the inline programmer is idle as well. If expensed using a standard five-year depreciation, there’s no guarantee that an inline programmer will not be sitting unused while it is still being paid for—possibly due to changes in project requirements or programmable devices. With product life cycles becoming shorter, it’s essential to evaluate the financial model before investing in inline programming.

Crystal Ball

It can be difficult to predict what your SMT line will require in the future. If your project changes or design modifications call for different programmable devices, your inline programming solution may no longer be useful. Increasing data requirements also tend to slow programming times, which may require additional inline hardware to maintain line throughput.

Off-line Programming

Off-line programming is a separate process where blank chips are programmed on high-speed robotic systems and placed into output media, usually tape. Off-line machines are best suited for medium to high volume and high-mix requirements. They offer greater flexibility, larger capacity, and can quickly adapt to new projects without becoming obsolete.

Flexible

Flexibility comes from the socket technology. Depending on the device, up to 4 sockets can be installed on each site. This allows for thousands of devices per hour—depending on programming complexity and optional operations such as laser marking.

Same Process

Off-line programming uses the same tape-based process as SMT placement machines. Reels of components are loaded by the operator, programmed, and returned as reels of programmed devices. These reels take up fewer feeder slots than inline programming systems and support uninterrupted production with multiple output reel locations.

Scalable

Off-line systems are scalable. As production needs grow, additional sockets, sites, or machines can be added. BPM systems are designed for three-shift operation with over 85% utilization and can support multiple SMT lines from a single off-line system.

High Mix

Inline SMT programming systems are generally not suited for high-mix environments, as each system is dedicated to a specific device type. BPM Automated systems can switch jobs in 15 minutes or less, offering far greater productivity and flexibility.

Small Footprint

Automated programming systems are compact relative to their capabilities. BPM’s latest system, the 3928, is just 162 x 96 cm and capable of programming 28 devices simultaneously. Systems install quickly and require only standard power and compressed air.

Conclusion

Inline SMT Programming Off-line Programming
Number of tape slots on SMT machine Up to 6 for each device 1-2 (depends on device/tape width)
Number of programmers 1 for each device (plus backup) 1
(can supply several SMT lines)
High volume programming Yes Yes
High mix No Yes
Universal No Yes
Require advanced operator No No
Scalable Limited/ Expensive* Yes
Need backup systems Yes No (spare site recommended)

*Inline is scalable but the cost is double to go from 1 to 2. Offline has an incremental cost much less than inline

Inline SMT programming is a solution to consider for high volume, low mix programming with very short programming times. It lacks the flexibility available from off-line programming systems. With advances in complex programming, especially for automotive applications, inline may be a good fit now, but will that still be true a year from now? For a growing number of companies and applications, off-line programming may be a future-proof investment that generates positive ROI in weeks, not years (see ROI article).

For more information about BPM’s Automated Programming Systems or to speak to one of our experts about your particular requirements, please call +1 (713) 688-4600 or toll-free in the US or Canada (855) SELL BPM.