by Scott Bronstad | Feb 22, 2023 | How To, New Device Support, News, Technology
Unlocking Faster Turnaround Times
Device Support Engineers are crucial to the development of accurate and reliable programming support for programmable devices. Their role involves researching the device’s architecture, understanding its programming requirements, and developing algorithms to program the device. Here’s a closer look at the key responsibilities and skills required of DS engineers:
Responsibilities of DS Engineers
- Research device specifications: DS engineers must research and understand the specifications of the device to determine its programming requirements. They must analyze the device’s architecture and functionality to develop accurate and reliable support.
- Develop algorithms for programming devices: DS engineers use their knowledge of programming languages, scripting, and automation tools to develop algorithms for programming semiconductor devices. They write code optimized for performance and accuracy based on the device’s architecture and functionality.
- Collaborate with other teams: DS engineers work closely with hardware and software engineers to troubleshoot issues and ensure that the device functions correctly. They collaborate to ensure that the device meets performance specifications.
Skills Required of DS Engineers
- Programming proficiency: DS engineers must be proficient in programming languages such as C, C++, Python, etc. They must be familiar with scripting and automation tools to optimize the programming process.
- Analytical and problem-solving skills: DS engineers must have strong analytical and problem-solving skills to identify the root cause of issues that arise during the programming process. They must be able to develop solutions to fix problems (“bugs”) quickly.
- Communication and collaboration skills: DS engineers must have excellent communication and collaboration skills to work effectively with other teams. They must be able to communicate complex technical information effectively and work collaboratively to ensure the device functions correctly.
Investing in DS Engineers
Companies that invest in developing their device support engineers can develop accurate and reliable support faster and more efficiently, leading to a competitive advantage. With new devices and technologies constantly emerging, DS engineers must continuously stay up-to-date with the latest programming languages, tools, and hardware platforms to adapt quickly to new development environments and technologies.
BPM has invested heavily in developing its DS engineer teams, doubling resources over the last 2 years. Becoming proficient in this role can take months of on-the-job training, working with other more experienced engineers. BPM’s investment is working: development times for average complexity projects have dropped from 10 or more weeks to an average of 2 to 4 weeks!
Conclusion
Device support engineers play a critical role in developing accurate and reliable support for programmable devices. They must have a deep understanding of the device’s architecture and functionality, as well as proficiency in programming languages, analytical and problem-solving skills, and communication and collaboration skills. Companies that invest in developing their DS engineers can develop accurate and reliable support faster and more efficiently, leading to a competitive advantage in the market.
Mastering eMMC Device Programming | White Paper: Semiconductor Device programming | Production-Level Support from BPM Microsystems | Apply for BPM Software Engineer
by Scott Bronstad | Jan 25, 2023 | Announcements, Events, News, Trade Shows
San Diego, CA – January 24, 2023 – BPM Microsystems, a leading provider of automated programming systems, is pleased to announce a great first day at the
APEX Expo 2023, taking place in San Diego from January 24th to January 26th.
BPM Microsystems can be found at Booth 1219, where they will be showcasing their latest offering, the BPM310 Automated Programming System. The company has reported a great first day at the expo, with 55 documented visitors to the booth and 6 machine demonstrations of the BPM310 system.
“We are thrilled to be participating in this year’s APEX Expo and to have the opportunity to showcase our innovative technology to such a large and diverse audience,” says Colin Harper, Director of Sales and Product Management for BPM Microsystems. “We would like to extend our congratulations to the team for their hard work in making this event such a success.”
BPM Microsystems invites all attendees to stop by booth 1219 to see the BPM310 Automated Programming System in action and to speak with their team of experts. To schedule a personal demonstration, click here (hurry, limited availability)
For more information on BPM Microsystems and the BPM310 Automated Programming System, click here.
Global SMT Live at APEX Expo 2023
by Scott Bronstad | Jan 4, 2023 | News
According to Global SMT, the Semiconductor Industry Association (SIA) noted in a report that as of May 2020, more than 40 new semiconductor ecosystem projects have been announced in the United States, including new factories, expansion of existing locations, as well as factories that supply and produce materials and production facilities. Combined, these projects are worth nearly $200 billion in private investment, reported in 16 states. All told, these new projects will create around 40,000 new high-jobs in the semiconductor fabrication market, expanding the availability of critical parts that are currently hard to get.
These projects especially affect Arizona, Connecticut, Georgia, Michigan, New York, Oregon, and Texas.
Below is a chart of development by State:
State
|
Company Name
|
City/County
|
Investment
|
Type
|
Employment (Direct)
|
| Arizona |
Intel |
Chandler |
$20 billion |
New |
3000 (2 fabs) |
| TSMC |
Phoenix |
$40 billion |
New |
4500 (2 fabs) |
| California |
Western Digital |
Fremont/San Jose |
$350 million |
Expansion |
240 |
| Florida |
SkyWater |
Osceola County |
$36.5 million |
Expansion |
220 |
| Idaho |
Micron |
Boise |
$15 billion (through 2030) |
New |
2000 |
| Indiana |
SkyWater |
West Lafayette |
$1.8 billion |
New |
750 |
| NHanced |
Odon |
$236 million |
New |
413 |
| Everspin Technologies |
Odon |
Unknown |
New |
35 |
| Trusted Semiconductor Solutions |
Odon |
$34 million |
New |
40 |
| Kansas |
Radiation Detection Technologies |
Manhattan |
$4 million |
Expansion |
30 |
| New Mexico |
Intel |
Rio Rancho |
$3.5 billion |
Expansion |
700 |
| New York |
Micron |
Clay |
$20 billion ($100B over 20 years) |
New |
9000 (4 fabs) |
| Global Foundries |
Malta |
$1 billion |
Expansion |
1000 |
| North Carolina |
Wolfspeed |
Chatham County |
$5 billion (over 10 years) |
New |
1800 |
| Ohio |
Intel |
New Albany |
$20 billion ($100B over 10 years) |
New |
3000 (2 fabs) |
| Oregon |
Analog Devices |
Beaverton |
$1 billion |
Expansion |
280 |
| Rogue Valley Microdevices |
Medford |
$44 million |
New |
Unknown |
| Texas |
Samsung |
Taylor |
$17 billion |
New |
2000 |
| Texas Instruments |
Sherman |
$30 billion (through 2030) |
New |
3000 (4 fabs) |
| Texas Instruments |
Richardson |
$6 billion |
Expansion |
800 |
| NXP |
Austin/TBD |
$2.6 billion |
Expansion |
800 |
| Utah |
Texas Instruments |
Lehi |
$3 billion |
Expansion |
1100 |
| TOTAL |
|
|
$186.6 billion
(up to $346.6 billion) |
|
34,708 jobs |
Read more here.
by Scott Bronstad | Dec 21, 2022 | Announcements, News
According to Global SMT, Samsung announced the world’s first DDR5 DRAM chips manufactured using 12nm semiconductor manufacturing technology. The company unveiled its 16Gb DDR5 DRAM chips and said they have already been evaluated for compatibility with AMD’s Zen processors.
The new chips are more efficient and offer 23% better performance than previous-generation DRAM chips. The South Korean company said it made this technological leap possible by using high-κ material, which increases cell capacitance. Samsung also used its own technology to improve critical circuits.
The company’s new DDR5 DRAM chips use advanced multi-layer lithography to achieve the industry’s highest die density and offer 20% higher wafer productivity. These chips are capable of transfer rates of up to 7.2 Gbps, which is equivalent to processing two 30GB 4K movies in one second.
Samsung will begin mass production of its 12nm class DDR5 DRAM chips in early 2023. Products based on these DRAM chips can be expected sometime in the last quarter of 2023.
DDR5
DDR5 (Double Data Rate 5) is a type of computer memory that is used in computers, servers, and other devices that require high-speed data transfer. It is the successor to DDR4 and offers improved performance and higher density compared to its predecessor.
The size of the technology used to manufacture a memory chip, such as DDR5, is typically measured in nanometers (nm). A smaller technology size generally allows for higher density and better performance, as it allows more transistors to be packed into a smaller area.
As of 2021, DDR5 memory chips are generally manufactured using technology sizes of 10nm or 12nm. Using a 12nm technology size allows for a higher density of transistors on the chip, which can lead to improved performance and power efficiency.
It is worth noting that technology sizes are constantly improving, and memory manufacturers are continually working on new technologies and processes to further improve the performance and density of their products.
Read Global SMT Article
by Scott Bronstad | Dec 15, 2022 | News
BPM Microsystems will display its 10th Generation programming technology platform, the BPM310, Automated Programming System, at the IPC APEX Expo.
IPC APEX is the largest event for electronics manufacturing in North America, attracting more than 9,000 professionals, from 45 countries.
BPM is celebrating 22 years of exhibiting at APEX, on its 38th anniversary as a company. Make plans now to attend IPC APEX Expo 2023, January 24-26, at the San Diego Convention Center, Booth 1219.
by Scott Bronstad | Dec 5, 2022 | News, Video
Colin Harper Video Interview from Electronica ’22
Karen “Kaz” Pearman speaks to Colin Harper, the Global Sales Director for BPM Microsystems during the Electronica 2022 Trade Show in Munich, Germany. Ms. Pearman is an independent journalist with “What’s New in Electronics” WNIE TV.
Issues faced in today’s marketplace
- Value (smaller form factor, same capacity)
- Greater socket density available on 10th Generation Sites
- 3D inspection (automotive quality) in a smaller system
- Supply Chain
- Verify the device before it is placed on PBC board
- Handles all media (tape, tube, tray)
- Universal support on one platform
View the WNIE TV playlist from electronica ’22 here
Global Sales Director, BPM
