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Bring Automated Programming In-House

Bring Automated Programming In-House

Controlling quality and lead time are two critical reasons manufacturers bring automated programming in-house. Model 3901 is ideal for EMS (Electronics manufacturing services) that have a high part mix and cannot predict what they will be programming in the future. BPM’s 9th Gen universal programming technology currently supports over 38K devices, with several new or updated devices supported weekly. In addition, the 3901 is universalit can handle nearly any package on the market today.

CyberOptics LNC-120 CameraThe precision of our premium CyberOptics on-the-fly alignment camera allows the 3901 to handle the smallest chip-scale package (1.0mm x 0.5mm) to the largest fine-pitch QFP. You can be confident that you will achieve the high quality and yield that you desire.

How to get started Programming In-House

The first step is to get a device list. Use the Device List template to fill in and email to marketing_department@bpmmicro.com. The minimum requirement to get an accurate budgetary quote is the device Part Numbers. The additional information is helpful, especially estimated volumes. From there BPM will confirm socket card (adapter) support and will be in a position to provide a proposal for your consideration.

Why BPM

BPM has installed hundreds of automated programming systems around the world. We would expect your system to be operational within five days of receipt at your factory, including operator training.
Device List Template (excel) Device Search  Email Device List Template

BPM Support for eMMC Devices in HS400 Mode

BPM Support for eMMC Devices in HS400 Mode

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

Manufacturer/Device Package 9th Gen Socket Purchase Online
Hynix Semiconductor H26M41208HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Hynix Semiconductor H26M41204HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Kingston EMMC04G-W627-X03U (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Micron MTFC4GACAJCN-1M WT (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
SanDisk SDINBDG4-16G (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLMAG1JETD-B041 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLM4G1FETE-B041 (HS400) BGA(153) Yes FVE4ASMC153BGR Yes
SkyHigh S40FC004C1B1C0000 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes

*HIC Socket (high capacity)


New eMMC Support for HS400 Mode

Hynix Semiconductor H26M41208HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Hynix Semiconductor H26M41204HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8804892672
  • Memory Regions: 0h-1 EFA7 FFFFh; 1 EFA8 0000h-2 0CCF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Kingston EMMC04G-W627-X03U (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4270325760
  • Memory Regions: 0h-F063 FFFFh; F064 0000h-FE87 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

Micron MTFC4GACAJCN-1M WT (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4402446336
  • Memory Regions: 0h-F7D3 FFFFh; F7D4 0000h-1 0667 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

SanDisk SDINBDG4-16G (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17737187328
  • Memory Regions: 0h-3 E67B FFFFh; 3 E67C 0000h-4 2137 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLMAG1JETD-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17597988864
  • Memory Regions: 0h-3 DEA5 FFFFh; 3 DEA6 0000h-4 18EB FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLM4G1FETE-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGR

SkyHigh Memory S40FC004C1B1C0000 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ
BPM’s File Builder Wizard makes eMMC Programming Easy

BPM’s File Builder Wizard makes eMMC Programming Easy

eMMC File Concatenate Wizard Saves Time, Streamlines Workflow, Reduces Errors



BPM Microsystems have the best programmers, especially when it comes to complex microprocessors and high-density eMMC devices. BPM’s 9th Generation universal programmers offer the fastest flash programming times, as well as the widest universal device coverage, all in a single, universal programming site. With over 40,000 supported devices, there’s no one else that comes close.

eMMC devices have large, complex data patterns (4GB and up) that can be difficult to set up and prone to operator error. Previously, you had to manually load each eMMC data pattern one by one through the buffer loader. Depending on the complexity, this step was repeated three or more times. Each data pattern also required a manual calculation of data offsets, with no way to provide the checksum. As eMMC devices have gotten larger, the technical challenge of the file structure has become more complicated.

That is, until now.

Now, you can use the configuration information (which should be provided with the eMMC device) to streamline your workflow, eliminate errors, and simplify set-ups. Utilizing a Microsoft Excel template, you can easily streamline file formatting by giving you one document to capture the specifics of the eMMC project, and then utilizing parts of it for the automation tool. The template can also be shared with 3rd parties or saved as a historical record of the project specifications.

On average, the eMMC Wizard should only take a few minutes to edit the data template, and about 10 minutes for the tool to create the data pattern. While the file is outputting, the tool automatically calculates the checksums and verifies them on the fly. Multiple checksum options are available from the pull-down in the Excel template. It also replaces the manual calculation for each offset with an automated calculator, reducing the possibility of errors.

eMMC File Builder Wizard

In order to use the eMMC File Concatenate Wizard, you’ll need the latest version of BPWin, which can be downloaded here. (If your Software contract is expired, you may need to renew it; contact Inside Sales).

All new eMMC algo development will use a standard template that supports the file Wizard. In some cases, older algorithms will not be compatible. Please enter a Device Support request if you need an update to a legacy algorithm that is not currently compatible with the Wizard. If an algo does not support it (yet), you will be presented with this message:

You can submit a device support request here.

eMMC Wizard Example

In this example, we’ll use a Samsung eMMC with HS400 support. Select the Samsung KLMAG1JETD-B041 device/algo in BPWin. Then navigate to the File Concatenation tool via either the “Device” menu in the BPWin toolbar or by clicking the “Device Config” button, followed by “File Concatenation“.

You will now be asked to select an input configuration file and an output location. Select the output location for your concatenated file.

The input will need to be a filled-out Excel sheet, based on the template found here. Fill out the GP_SIZE_MULT_X fields (provided by the semi house), and the list of files, offsets, and checksums below. Don’t forget to select a specific checksum type from the dropdown menu, or the tool will not know how you want the checksum calculated.

Here are some examples of filled-out templates:

(Since the template requires user-inputted paths to the specified files, you need to ensure that the files are actually located there.)

Once you have selected an input configuration file and output location, click “Concatenate” and wait for the operation to finish. In the end, there should be an “output.bin” file located in the folder you specified earlier.

The green status bar will let you know your file is processing. Depending on file size, this may take several minutes

The concatenate wizard takes a few minutes to finish. If you are utilizing HS200 or HS400, you’ll still need to run the file through the image format tool– navigate via either the “Device” menu in the BPWin toolbar or by clicking the “Device Config” button, followed by “image format“ (remember, this is for HS200/400).

That’s it!

In summation, the eMMC File Wizard makes eMMC programming much easier and faster by walking through the steps to quickly build your files. This ensures quality programming results from first article qualification through production.

The eMMC File Concatenation Wizard is available with BPWin Version 7.0.7 and later. If you have any questions, please reach out to our Technical Support team. If you need to update your software agreement, please contact Inside Sales.

Summer BBQ at BPM

Summer BBQ at BPM

BPM enjoyed some real Texas BBQ at our Summer Barbecue; it was an opportunity to celebrate getting most folks back in our facility in Houston, Texas. Originally, we planned on having it out on the back parking lot, but it was too dad-gum hot. Food was catered by Rudy’s, a Texas BBQ institution: Brisket, Chicken, plus all the trimmings, including some real down-home cobbler and banana pudding. For those of you not fortunate to live near a good Barbecue joint, you can order just about anything and have it delivered just about anywhere– check out their store here.

HS400 Programming Improves eMMC Performance

HS400 Programming Improves eMMC Performance

According to the JESD84-B51 standard, eMMC v5.1 supports the following bus speed modes and clock frequencies:

Mode

Data
Rate

I/O Voltage

Bus Width
(bits)

Frequency

Max. Data Transfer 

HS400 Dual

1.8/1.2 V

8

0-200 MHz

400 MB/second

HS200

Single

1.8/1.2 V

4, 8

0-200 MHz

200 MB/second

High-Speed DDR

Dual

3/1.8/1.2 V

4, 8

0-52 MHz

104 MB/second

High-Speed SDR

Single

3/1.8/1.2 V

1, 4, 8

0-52 MHz

52 MB/second

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

BPM has recently added support for the following eMMC devices in HS400 Programming Mode:

Manufacturer/Device Package 9th Gen Socket Purchase Online
SanDisk SDINBDG4-8G (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Samsung KLMCG2KCTA-B041000 (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Micron MTFC32GAKAEJP-AIT (HS400) BGA(153) Yes FVE4ASMC153BGZ
Micron MTFC32GAKAECN-4M IT (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRQ (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRN (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRI (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRA (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes

HS400 Programming Mode

SanDisk SDINBDG4-8G (6/22/2021)

SanDisk SDINBDG4-8GDevice Parameters

  • Manufacturer: SanDisk (ID=45h)
  • Part Number: SDINBDG4-8G (HS400) (ID=3038h)
  • 8-bit Bytes: 8807030784
  • Memory Regions: 0h-1 EFC6 CFFFh; 1 EFC6 D000h-2 0CF0 9FFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Samsung KLMCG2KCTA-B041000 (6/22/2021)

Device Parameters

  • Manufacturer: Samsung (ID=15h)
  • Part Number: KLMCG2KCTA-B041000 (HS400) (ID=3432h)
  • 8-bit Bytes: 70354206784
  • Memory Regions: 0h-F 7877 FFFFh; F 7878 0000h-10 616F FE1Fh; 10 616F FE20h-10 6170 003Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 64 GByte
  • Socket: FVE4ASMC153BGJ

Micron MTFC32GAKAEJP-AIT (6/22/2021)

Micron-MTFC32GAKAEDevice Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAEJP-AIT (HS400) (ID=374Ch)
  • 8-bit Bytes: 35181822048
  • Memory Regions: 0h-7 BC7F FFFFh; 7 BC80 0000h-8 30FF FE3Fh; 8 30FF FE40h-8 3100 005Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGZ

Micron MTFC32GAKAECN-4M IT (6/22/2021)

Micron-MTFC32GAKAE

Device Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAECN-4M IT (HS400) (ID=374Ch)
  • 8-bit Bytes: 33218887808
  • Memory Regions: 0h-7 4DFF FFFFh; 7 4E00 0000h-7 BBFF FE5Fh; 7 BBFF FE60h-7 BC00 007Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRQ (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRQ (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 Gig
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRN (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRN (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRI (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRI (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRA (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRA (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ